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Surface Pretreatment
Clean the PCB to remove grease, dust, and other contaminants.
Acid cleaning (dilute sulfuric acid or hydrochloric acid) removes oxides.
Purpose: Ensure uniform nickel adhesion.
Activation
Treat the surface with an activator (e.g., acid tin/palladium solution) to enhance conductivity and adhesion before plating.
Nickel Plating
Temperature: 45–60 °C
Current density: 2–6 A/dm² (depends on board thickness and layer requirements)
pH: 3.5–4.5
Plating thickness: Typically 1–10 μm, depending on PCB application
Process Types: Electrolytic nickel plating or electroless (chemical) nickel plating.
Electrolyte Composition: Nickel sulfate (NiSO₄·6H₂O), boric acid (H₃BO₃), organic additives (brighteners, leveling agents).
Process Parameters:
Post-Treatment
Rinse thoroughly to remove residual plating solution.
Dry the PCB.
Optional: Apply protective layers (palladium, gold) or sealing treatment for corrosion resistance.
Hard Chrome Plating | Precision Metal Surface Treatment Services
